Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosi...
Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures.
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